| 摘要 |
<p>PURPOSE: To provide a TAB connection method wherein deterioration is not generated when strong pressure is applied during TAB inner lead bonding, a board is not heated during TAB outer lead bonding and highly reliable connection can be carried out without enlarging a pat area. CONSTITUTION: In a TAB connection method for semiconductor mounting, a process for coating inner lead bonding copper fingers 311, 321 with lead layers 312, 322 and performing heat treatment for it and a process for bonding the inner lead bonding fingers 311, 321 to a bump of a semiconductor device are executed.</p> |
