Process for realizing trench isolation structures

摘要

A novel process for forming, on a semiconductor substrate, a dielectric isolation structure between two zones of an integrated circuit wherein active regions of electronic components integrated thereto have already been defined, comprises the steps of: defining an isolation region (45) on a layer of silicon oxide (42) overlying a silicon layer (41); selectively etching the silicon (41) to provide the isolation region (45); growing thermal oxide (43) over the interior surfaces of the isolation structure (45); depositing dielectric (46) conformingly; and oxidizing the deposited dielectric (46).