发明名称 |
DRAM trench capacitor with insulating collar |
摘要 |
An improved trench cell capacitor (32) within a semiconductor body and methods for producing the same are presented. The improved capacitor, which is suitable for use in 64 Mb DRAMs and other memory cells, comprises a trench cell (21) having doped semiconductor material (38,37) disposed therein, and an oxide isolation collar (24) surrounding the doped material. A thin nitride layer (25) is disposed between the oxide isolation collar and the doped material, resulting in a configuration which provides improved trench cell capacitor processing. <IMAGE> |
申请公布号 |
EP0735581(A1) |
申请公布日期 |
1996.10.02 |
申请号 |
EP19960103698 |
申请日期 |
1996.03.08 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
GRAIMANN, CHRISTOF;SCHULZ, ANGELIKA;BOIT, CHRISTIAN |
分类号 |
H01L23/52;H01L21/318;H01L21/3205;H01L21/768;H01L21/822;H01L21/8242;H01L27/04;H01L27/108 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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