TREATMENT METHOD, RESIST TREATMENT METHOD AND RESIST TREATMENT DEVICE

摘要

PURPOSE: To integrate a work time in a first treatment part and a second treatment part and unify treatment by providing a pre-standby time for treatment of the second treatment part when there is a difference in a treatment time between both treatment parts. CONSTITUTION: When an exposure treatment part 2 for performing exposure treatment for a wafer and an application/development treatment parts 3 with a heat treatment device for performing post exposure baking treatment for a wafer after exposure treatment are connected through an interface part 4 which delivers a wafer, a pre-standby time inside a heat treatment device is set according to a work time of exposure treatment.