| 摘要 |
PURPOSE: To realize high reliability of a plastic molded type semiconductor device. CONSTITUTION: A lead frame 1 is the part for mounting a semiconductor element, and consists of the following; an island part 3 retained by suspension leads 2, an inner lead part 4 for electric connection with a mounted semiconductor element, and an outer lead part 6 which is fixed by a tie bar part 5 and connects the inner lead part 4 with the outside. On the surface of the island part 3, silver plating parts 13 are formed point-wise on only the spreading positions of adhesive paste. Since silver plating is performed only for the above silver plating part 13, the leak of silver plating material to the back of the island part 3 is not generated. As the result, the adhesion of a semiconductor element and the island part and ohmic properties can be ensured, and the heat resistance and the reliability of a semiconductor device can be improved. |
