发明名称 |
Form zur Herstellung von Kunststoffpackungen für integrierte Schaltungen, die eine Wärmesenke enthalten |
摘要 |
A mold (10) for the manufacture of integrated circuit packages (1) of plastics, incorporating a heat sink (3,8), comprises a first half-shell (11) having a rest bottom (12) for the heat sink (8), which is associated with a metal frame (7) having a central portion carrying the integrated circuit and being held by filaments (4A), and a second half-shell (13) arranged to overlie the first (11) and having at least one elevated portion (16) which will compress said filaments (4A) on the half-shells (11,13) being laid over each other. <IMAGE> <IMAGE> |
申请公布号 |
DE69117919(T2) |
申请公布日期 |
1996.09.26 |
申请号 |
DE1991617919T |
申请日期 |
1991.12.16 |
申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L., AGRATE BRIANZA, MAILAND/MILANO, IT |
发明人 |
PEREGO, CAMILLO, I-20052 S. ALBINO-MONZA (MILANO), IT |
分类号 |
B29C33/42;B29C45/02;B29C45/14;B29C45/26;B29K105/22;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 |
主分类号 |
B29C33/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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