| 摘要 |
An electronic micropackage for an electronic memory card, particularly applicable to large-sized semiconductor chips. The micropackage includes a semiconductor chip disposed on a first face of an insulating support, and electrical contact zones extending along a plane defined by a second face of the insulating support. The semiconductor chip is connected to the electrical contact zones via connection wires. A metal strip is provided with cut-outs defining the electrical contact zones. A strip of insulating material is disposed on one face of the metal strip, the strip of insulating material constituting said insulating support, and leaving uncovered, at least in part, the electrical contact zones. A housing for the semiconductor chip, surrounding the insulating support and obstructing those cut-outs in the metal strip which are inside the housing and which are not obstructed by the insulating support. A coating of resin covers the semiconductor chip and the connection wires, at least partially filling the housing. |
