| 摘要 |
<p>PURPOSE: A solid photographing device and manufacturing method are provided to shorten the distances between a lens and the semiconductor area of a light receiving sensor unit, thereby preventing color mixture. CONSTITUTION: A light sensor unit is formed in a silicon layer(4). A first support substrate(2) includes a bonding layer on the silicon layer. A wire unit is formed on the silicon layer. A second support substrate is bonded with the wire unit. A reflection preventing film, a color filter(5), and an on-chip lens(6) are successively formed on the silicon layer.</p> |
