| 摘要 |
<p>PURPOSE: To bond a land grid array package with a printed board, which has a different thermal expansion coefficient compared with the package, with high reliability. CONSTITUTION: A land grid array semiconductor package 101, which has an array type terminal electrode 102, and a printed board 103, which has an electrode 104 with the same arrangement as the array type terminal electrode, are electrically connected through a flexible stress relaxing connecting medium 105, which has a first connecting pad 107 that connects with the array type electrode 102 of the land grid array package 101 and a second connecting pad 108 that connects wnth the electrode 104 of the printed board 103.</p> |
