SEMICONDUCTOR ELEMENT AND METHOD HAVING THERMAL SPRAYING THERMAL DIFFUSION LAYER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element provided with a thermal diffusion layer and the manufacture for improving thermal conductivity, making treatment processes less than conventional processes sufficient, providing TCE suited to a semiconductor die and closed not need solder for performing adhesion to the semiconductor die. SOLUTION: This semiconductor element is provided with a thermal diffusion layer 18 of a material attached by thermal spray on the back surface of the semiconductor die 12. The semiconductor die 12 is provided with a thermal expansion coefficient almost similar to the thermal expansion coefficient of a thermal spray material. The thermal spray material can be directly attached onto the semiconductor die 12 or attached on a back metal layer 15. The thermal diffusion layer 18 is suitable for attaching the semiconductor die 12 to a metal substrate 27.