| 摘要 |
PURPOSE: To reduce the surface ruggedness of a wiring board by filling up a via hole with a plated metal. CONSTITUTION: A first wiring layer is formed on an insulating,film 2 formed on a substrate. Then, after an interlayer insulating film 5, via hole 6, and base conductor film 3b are successively formed on the first wiring layer, with the via hole 6 being formed in the insulating film 5, a photoresist layer 7 is formed. After the photoresist layer 7 is formed, the conductor layer 3b is exposed by exposing the photoresist layer 7 on the hole 6 to light and the via hole 6 is filled up with a plated metal 10. Then the photoresist layer 7 is again formed and a wiring pattern is formed by exposing and developing the photoresist layer 7. After the wiring pattern is formed, a second wiring layer is formed by laying conductors 4b along the pattern. Finally, the base conductor film 3b is removed from the parts where the photoresist 7 and conductor 4 are not formed. |
