发明名称 |
Process for fabricating two loads having different resistance levels in a common layer of polysilicon |
摘要 |
The present invention provides a method of forming a first load having a first resistance level and a second load having a second resistance level in a common layer of polysilicon. In accordance with the method, a layer of polysilicon having a first resistance level is formed on a semiconductor circuit structure. A mask is then formed on the polysilicon layer to define areas of the polysilicon to be implanted with a dopant. The dopant is then implanted into the defined areas of the polysilicon to modify these areas to have a second resistance level. Selected areas of the polysilicon layer are then etched away to form first load regions having the first resistance level and second load regions having the second resistance level.
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申请公布号 |
US5554554(A) |
申请公布日期 |
1996.09.10 |
申请号 |
US19940198698 |
申请日期 |
1994.02.18 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
BASTANI, BAMDAD;WONG, LARRY |
分类号 |
H01L29/73;H01L21/331;H01L21/768;H01L21/8249;H01L23/532;H01L27/06;H01L29/732;(IPC1-7):H01L21/824 |
主分类号 |
H01L29/73 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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