发明名称 OXIDE FILM FORMING METHOD OF SEMICONDUCTOR DEVICE
摘要 The method of forming oxide film of semiconductor device comprises the steps of : inserting a wafer into a tube and increasing the temperature high; growing an oxide film by mixing O2:H2:DCE(Dichloroethylene); annealing the oxide film; and drawing out the wafer from the tube.
申请公布号 KR960011935(B1) 申请公布日期 1996.09.04
申请号 KR19920027070 申请日期 1992.12.31
申请人 HYUNDAI ELECTRONICS IND. CO., LTD. 发明人 UM, KEUM - YONG;LIM, JAE - EUN;JOO, MOON - SIK;PARK, MI - RA
分类号 H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/316
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