| 摘要 |
PURPOSE: To meet multi-pin design by reducing a pitch of an inner lead of a lead frame. CONSTITUTION: A width of a mask film 2b in a part covering each inner lead 3 covering an opposite surface of a wire-bonding surface is made obviously narrower than a mask film 2a covering a wire bonding surface and a lead frame is patterned by etching the lead frame material 1 from both surfaces by using the mask films 2a, 2b as a mask. Thereafter, coining is performed for at least the inner lead 3. Thereby, a width Lb in at least a lower surface of an inner lead is a little enlarged by performing coining for at least the inner lead 3. |
