LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE MANUFACTURE DEVICE

摘要

PURPOSE: To realize high mounting while realizing compactness by enlarging a lead pitch interval at a solder land part by providing a lead pattern which extends radially around a die pad arranged in a central part of a conductive disc member. CONSTITUTION: A circular lead frame wherein a lead is extended radially from a die pad at a central part is completed by punching a lead frame element material 9 formed to prepare one IC package to one lead frame by a press. Then, a semiconductor chip 5 is die-bonded to the lead frame 10. After a gold line 7 is wire-bonded, it is formed by molding by using resin 8. Then, resin burr 11 between leads 6 is removed by a process in a press die, a die bar 12 and an outer circumferential ring 13 are pulled down, lead bending processing is performed for the lead 6 by a punch and a die of a circular die set and a semiconductor integrated circuit is completed.