READ FRAME FOR SEMICONDUCTOR DEVICES

摘要

PURPOSE: To provide a lead frame for semiconductor devices which can be made with the least dam burr and has a high degree of freedom in its molding step. CONSTITUTION: A lead frame 1 for semiconductor devices has a dam bar 12 to connect and support the middles of lead terminals 4. The dam bar 12 is disposed near a parting line of the main body of package 7.