| 摘要 |
PURPOSE: To provide an epoxy resin composition which comprises specific biphenyl type epoxy resin, phenolic resin, curing accelerator, and molten silica powder, respectively in prescribed amounts, thus is useful as a semiconductor sealant because of its reduced moisture influence, excellent resistance to welding heat. CONSTITUTION: This epoxy resin composition comprises (A) a biphenyl type epoxy resin of formula I, (B) a phenolic resin, (C) a mercapto-modified silicone oil, (D) a molten silica powder having less than 100μm maximum particle size and (E) a curing accelerator of imidazole or the like where the amount of component D is 25-90wt.% of the whole resin composition. It is preferred that a semiconductor chip is sealed with the cured product of this composition.
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