| 摘要 |
PURPOSE: To provide a bonding method for bonding a connection terminal coated with a protection film from the protection film without removing the protection film. CONSTITUTION: A connection terminal 3 provided in an electronic circuit board is coated with an insulation protection film 4. A bonding wire 2 or a ball 1 is positioned on the protection film on the connection terminal part required, for a connection, and pressurized and energized and heated by a bonding chip 6, and the insulation protection film 4 is deformed by further applying ultrasonic waves, and the bonding wire 2 or the ball 1 is bonded to the connection terminal 3. Accordingly, there are removed operations for removing the protection film on the connection terminal required conventionally, so that investments of facilities or capable men can be suppressed and working hours in the entire modification operations can be decreased. |
