Semiconductor integrated circuit apparatus including clamped heat sink

摘要

The present invention provides a semiconductor integrated circuit apparatus with a heat sink that can be changed in size, that accommodates a board and electronic parts having different sizes, and that increases heat radiation. The present invention includes a cooling member facing and connected to electronic parts via a thermally conductive resin or thermally conductive fat and fatty oil and at least two thermally conductive clamps that are soldered to a board and that support portions of the perimeter of the cooling member.