| 摘要 |
<p>PURPOSE: To provide a semiconductor device which is capable of coping with the increase in the number of terminals attendant on a fact that a semiconductor element is lessened in size and increased in the number of electrode pads by a method wherein a semiconductor element is mounted and bonded onto the surface of an inner lead opposite to its wire bonding surface and a die pad, and the tip of the inner lead and the terminal of the semiconductor element are electrically connected together. CONSTITUTION: A semiconductor element 11 is mounted and bonded onto the surface of an inner lead tip 21A opposite to its wire bonding surface 21AS and a die pad 23, and the inner lead tips 21A is electrically connected to the electrode pad 12 of the semiconductor element 11 with a wire 13. An outer lead 22 is fairly heavier than the inner lead tip 21A, and the cross section of the outer lead 22 is nearly like a rectangle formed of two opposed sides 22a and 22c and the other two sides 22b and 22d which are set projecting outwards. By this setup, the thin-walled inner lead tip 22A is capable of being reinforced by the die pad 23 when the semiconductor element is mounted, and furthermore an electrode pad 12 is capable of being positioned in a wider range, and a wiring is enhanced in freedom of layout.</p> |
