| 摘要 |
PURPOSE: To provide a method for efficiently laminating a multilayer copper-clad laminated board and a method for heating, pressurizing and molding in which the positional deviation can be prevented. CONSTITUTION: A multilayer copper-clad laminated board is manufactured by the steps of providing a plurality of guide holes 4 for interlayer aligning an inner layer printed wiring board 2 having a conductor circuit with a prepreg 1 of adhesive, inserting laminating pins 5 to align it, then heating the pins 5 to 110 to 180 deg.C to cure the prepreg 1 in ring state of about 10mm of the periphery of the pins 5, adhering the prepreg 1 to the board 2, then removing the pins after adhering, laminating the outer layer copper foil 3, heating, pressurizing and molding it. |
