| 摘要 |
PURPOSE: A method for plating a palladium or palladium alloy of a BGA(Ball Grid Array) package device is provided to form a palladium or a palladium alloy coating layer on a BGA package device to increase corrosion resistance, a soldering property, and an adhesive quality. CONSTITUTION: The first coating layer is formed on a BGA(Ball Grid Array) package by sustaining the temperature of the first coating material from 25 to 50 deg.C. 2.0¯3.0 ASD(Ampere per Square Decimeter) of current is induced for generating the first coating layer. The second coating layer is made on the first coated BGA package by maintaining the temperature of the second coating material from 35 to 45 deg.C. 0.7¯5.0 ASD of current is applied for formingthe second coating layer. A plating metal layer is built on the second coated BGA package by keeping the temperature of the material for plating from 30 to 45 deg.C. 0.7¯1.5 ASD of current is needed to produce the planting metal layer.
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