发明名称 SIGNBOARD OF LIGHT-EMITTING DIODE
摘要 PROBLEM TO BE SOLVED: To effectively prevent the adverse effect by distortion power of thermal shrinkage and to greatly improve durability by easily, rapidly and surely fitting a substrate with many light-emitting diodes. SOLUTION: The signboard of the light-emitting diodes is constituted by inserting the plural light-emitting diodes 4 into through-holes 13A of the substrate 13 and fixing the diodes to home positions. Buffer cylinders 25 are inserted into the through-holes 13A of the substrate 13, and the light-emitting diodes 4 are inserted and fixed to the buffer cylinder 25. The buffer cylinders 25 are formed by molding plastic or rubber into a cylindrical shape.
申请公布号 JP2002202740(A) 申请公布日期 2002.07.19
申请号 JP20000402623 申请日期 2000.12.28
申请人 SILVER MAKING KK 发明人 ASANO HIROKAZU
分类号 F21V19/00;F21Y101/02;G09F13/20;H01L33/12;H01L33/58;H01L33/60 主分类号 F21V19/00
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