FLATTENING OF INSULATED WIRING LAYER

摘要

PROBLEM TO BE SOLVED: To enhance the planarity of a device inexpensively in a short time. SOLUTION: In a semiconductor device employing a reticulated conductor and a selectively plagiarized interlayer insulating deposition (ILD) in order to enhance the planarity of interconnect layer and a fabrication method therefor, the reticulated conductor 52 is used in place of a solid conductor if the width of solid conductor is wider than a critical width depending on the process and design.