| 摘要 |
PURPOSE: To obtain an interface device by which a semiconductor substrate is held in a high vacuum, by which fine particles on a wafer and contamination or oxidation on the order of an atomic layer are suppressed and by which the wafer is conveyed between treatment device containers. CONSTITUTION: A conveyance container 1 in which a wafer 9 to be conveyed has been put is attached to a load-lock chamber 3, and the load-lock chamber 3 is evacuated to produce a vacuum. A door 6 for the conveyance container is opened by an open-and-close auxiliary mechanism 7, it is brought into close contact with the inside wall of the load-lock chamber 3, and a space 8 is evacuated to produce a vacuum. After that, the wafer is conveyed into a treatment device 2 by a conveyance mechanism 10. The wafer which has been treated is moved to the load-lock chamber, and the door for the conveyance container is closed by the open-and-close auxiliary mechanism 7. When the load-lock chamber is leaked up to an atmospheric pressure, the conveyance container 1 is separated from the load-lock chamber 3, and the conveyance container 1 is transported to another treatment device. Thereby, while a high vacuum is being maintained, the wafer can be delivered between the conveyance container and the treatment devices, and fine particles stuck during the conveyance of the wafer and contamination on the order of an atomic layer can be prevented. |
