发明名称 RESIN MOLD APPARATUS
摘要 PURPOSE: To enhance the accuracy of the support position of a lead frame by utilizing a movable support pin as a support pin at the time of the injection of a resin to prevent the formation of a small hole to a resin mold part after completion by the support pin. CONSTITUTION: A plurality of support pins 26 are held by two holding members (movable plates) 27 arranged above the cavity block 2a of an upper mold 21. In this holding state, the support pins 26 pierce the cavity block 2a up and down to be arranged so that the leading ends thereof can come into contact with the leading end part of a lead frame C from above. The movable plate 27 is provided so as to be reciprocally movable between a lower support position where the support pins 26 are brought into contact with the leading end part of the lead frame C and an upper pull-out position where the support pins are allowed to be spaced apart from the lead frame C and moved to a support position to be brought into contact with the cavity block 21a in a key driving state. When a resin is injected into a cavity 23 to a certain degree, a ball screw spline 37 is raised to move the support pins 26 to the upper pull-out position.
申请公布号 JPH08192446(A) 申请公布日期 1996.07.30
申请号 JP19950006229 申请日期 1995.01.19
申请人 TOSHIBA FA SYST ENG KK;TOSHIBA CORP 发明人 SAWADA HIROYUKI;TAKEGAWA YUJI
分类号 B29C33/12;B29C45/02;B29C45/14;B29C45/26;B29L31/34;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C33/12
代理机构 代理人
主权项
地址