PACKAGE ASSEMBLING STRUCTURE FOR SEMICONDUCTOR PRESSURE SENSOR,申请号JP19950003667-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PACKAGE ASSEMBLING STRUCTURE FOR SEMICONDUCTOR PRESSURE SENSOR
摘要
申请公布号	JPH08193898(A)	申请公布日期	1996.07.30
申请号	JP19950003667	申请日期	1995.01.13
申请人	FUJI ELECTRIC CO LTD	发明人	KOBAYASHI KAZUNORI
分类号	G01L9/04;G01L9/00;G01L19/00;(IPC1-7):G01L9/04	主分类号	G01L9/04
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Flavoring composition concentrates

Dehumidification method and apparatus

Continuous food freezing device and continuous food freezing method

Weed trimmer and edger attachment for riding lawnmowers

Method for reporting a channel quality indicator by a relay node in a wireless communication system, and apparatus for same

Technologies for network packet cache management

Obtaining content from remote source for playback

Isolation region fabrication for replacement gate processing

Friction pads for use with a gripping and/or climbing device

<i>Farfugium </i>plant named ‘Wavy Gravy’

Apple tree rootstock named ‘G.814’

Dishwasher and/or components thereof

Dishwasher and/or component(s) thereof

Bracket for a sound processor and a coil

Ventilator grill

Spreader attachment for decorative semiochemical fixture