发明名称 Copper conducting wire structure and fabricating method thereof
摘要 A copper conducting wire structure is for use in the thin-film-transistor liquid crystal display (LCD) device. The copper conducting wire structure includes at least a buffer layer and a copper layer. A fabricating method of the copper conducting wire structure includes the following steps. At first, a glass substrate is provided. Next, the buffer layer is formed on the glass substrate. The buffer layer is comprised of a copper nitride. At last, the copper layer is formed on the buffer layer.
申请公布号 US7289183(B2) 申请公布日期 2007.10.30
申请号 US20050219718 申请日期 2005.09.07
申请人 AU OPTRONICS CORP. 发明人 GAN FENG-YUAN;LIN HAN-TU;TU KUO-YUAN
分类号 G02F1/1343;B32B3/00 主分类号 G02F1/1343
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