发明名称 PROBE ASSEMBLY FOR INJECTION MOLDING APPARATUS
摘要 <p>A temperature and molding material pressure compensated probe (10) for use in injection molding apparatus (13) is disclosed. The probe includes a two-part telescoping body (34, 35) with a molding material filled space (32) therebetween. Longitudinal thermal expansion which formerly presented sealing problems only results in changes in the extent of telescoping overlap. Molding material pressure is applied equally to both probe parts tending to improve sealing. The molding material filled space has a greater transverse area than all outlets and passages.</p>
申请公布号 WO1996021548(A1) 申请公布日期 1996.07.18
申请号 US1995013085 申请日期 1995.10.04
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