INSPECTING METHOD OF SEMICONDUCTOR DEVICE AND CONDUCTIVE ADHESIVE FOR THE INSPECTION

摘要

PURPOSE: To obtain a method for inspecting an operation of a chip package or a multichip module without causing a warp in a chip carrier and without impairing the stability of connection of an LSI chip, and a conductive adhesive for inspection thereof, by connecting contact electrodes of the chip carrier or the multichip module and terminal electrodes of an inspecting device electrically through of the conductive adhesive for inspection. CONSTITUTION: A ball-shaped projecting electrode 9 formed on a contact electrode 8 is immersed in a film 15 of a conductive adhesive 17 for inspection and drawn up, so that the conductive adhesive 17 for inspection be transferred onto and formed on the ball-shaped projecting electrode 9. Subsequently, the electrode is put on a terminal electrode 18 of an inspecting device 19 with the position aligned thereto and thus the ball-shaped projecting electrode 9 and the terminal electrode 18 of the inspecting device are connected electrically by the conductive adhesive 17 for inspection. Thereafter an operation of a chip package or a multichip module is inspected.