| 发明名称 |
Solder, microelectromechanical component and device, and a process for producing a component or device |
| 摘要 |
A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.
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| 申请公布号 |
US7402910(B2) |
申请公布日期 |
2008.07.22 |
| 申请号 |
US20040789423 |
申请日期 |
2004.02.27 |
| 申请人 |
MICROPELT GMBH;FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG E.V. |
发明人 |
BOETTNER HARALD;SCHUBERT AXEL;JAEGLE MARTIN |
| 分类号 |
H01L23/48;B23K35/02;B23K35/26;B81C3/00;H01L23/38;H01L23/488;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
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