| 摘要 |
A multilayer interconnection substrate comprising the first to third power interconnections provided with the first to third interconnection layers, the first insulating layer provided between said first and second interconnection layers, the second insulating layer provided between said second and third interconnection layers, a plurality of the first via holes which are provided at said first insulating layer and connect said first and second power interconnections and a plurality of the second via holes which are provided at said second insulating layer with the position being shifted from that of said first via holes and connect said second and third power interconnection. The substrate has lower distribution resistance. |
