| 摘要 |
<p>A method is disclosed for packaging for an integrated circuit (19) having lead frames with closely spaced leads (22, 23, 24) that are configured in such a way that the bonding wires (20, 21) must cross over other leads prior to bonding to the appropriate lead. The method includes the formation of a modified lead frame such that the likelihood of electrical contact between the bonding wires (20, 21) and leads crossed (22, 24) over by bonding wires is reduced. In one embodiment, insulating film (26) is placed on an adjacent lead (22, 24), or additionally on a number of crossed over leads, directly under the path of the bonding wire (20, 21) such that the potential for electrical contact is reduced. In a second embodiment, a depression (32) is formed on an adjacent lead (30), or additionally on a number of crossed over leads, causing additional clearance to be created between the bonding wire (28) and the lead (30) such that the likelihood of contact is reduced. In a third embodiment, a stepped depression (34) is formed on the bonded lead (36) such that the depression (34) facilitates the bonding of the wire (38) at an increased incline resulting in additional space between bonding wire (38) and the crossed leads (37) thereby reducing the likelihood of contact.</p> |
