| 摘要 |
A metal surface, usually copper, is micro-roughened to improve adhesion of polymeric materials, by the use of an adhesion-promoting composition comprising hydrogen peroxide, an inorganic acid, a corrosion-inhibitor which is for example a triazole, tetrazole or imidazole, and a quaternary ammonium surfactant. The process is of particular value in production of multi-layer PCBs to promote inter-layer adhesion. |
