发明名称 Printed circuit board having improved solder drainage pads
摘要 <p>The present invention relates to a printed circuit board of the known type comprising a metallised drainage region (30, 32), downstream from at least some of the metallised connection regions (10, 12), with respect to the direction of movement of the board, characterized in that it further comprises at least one intermediate metallised region (40) interposed between the connection region (10, 12) and the drainage region (30, 32), the said intermediate region (40) being separated both from the connection region (10, 12) and from the drainage region (30, 32). <IMAGE></p>
申请公布号 EP0660650(B1) 申请公布日期 1996.06.19
申请号 EP19940402994 申请日期 1994.12.22
申请人 MAGNETI MARELLI FRANCE 发明人 REAU, JEAN-PAUL
分类号 H05K1/11;H05K1/18;H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K1/11
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