Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit

摘要

An ink composition is provided for forming an ultra-thick thick film which is suitable for conducting heat laterally from a heat generating device supported on a substrate. The ink composition is formulated to enable the ultra-thick thick film to be formed as a single layer, such that only a single print, dry and fire cycle is required to form the film. Advantageously, ultra-thick thick films having thicknesses of about 125 micrometers (about 0.005 inch) and greater can be formed by a single layer of the ink composition.