发明名称 CONDUCTIVE PASTE
摘要 PURPOSE: To provide conductive paste without generating a crack even in a boundary part between different film thickness. CONSTITUTION: Conductive paste consists of spherical and flack-shaped silver powder, low softening point glass frit, organic rhodium and an organic vehicle. In the flake-shaped silver powder, compounding ratio relating to silver powder total quantity is set to within a 15 to 80wt.% range, and in the organic rhodium, compounding ratio relating to silver powder total quantity of contained rhodium is set to within a 0.0001wt.% or less range.
申请公布号 JPH08148032(A) 申请公布日期 1996.06.07
申请号 JP19940291435 申请日期 1994.11.25
申请人 MURATA MFG CO LTD 发明人 KANO HARUHIKO
分类号 H05K1/09;B22F1/00;C03C8/16;C22C32/00;H01B1/00;H01B1/16;H01B1/22;H05B3/84;(IPC1-7):H01B1/16 主分类号 H05K1/09
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