| 摘要 |
PURPOSE: To prevent the deformation or the break of a semiconductor element or the deformation or the cutting of a bonding wire by making the rate of the filler material in a silicone hardening substance layer apart from the element larger than the rate of the filler material in the hardening substance layer close to the element. CONSTITUTION: After a semiconductor element 2 is mounted on the surface of a substrate 1, a bonding pad 3 in the upper end of the element 2 is electrically connected to a lead frame 5 by a bonding wire 4 made of gold. The surface of the element 2 is covered with a silicone hardening substance 7 in which a filler material 8 having the average particle diameter of 0.01 to 500μm and the specific gravity of 0.01 to 0.95 is dispersed. Particularly, the rate of the filler material 8 in the hardening substance layer 7 apart from the element 2 is made larger than the rate of the filler material 8 in the hardening substance layer 7 close to the element 2. Thereby, in the solvent washing after an electric circuit board is mounted, the hardening substance 7 covering the surface of the element 2 is hard to swell, and as a result, the deformation or the break of the element 2 or the deformation or the cutting of the bonding wire 4 is not generated. |
