| 摘要 |
PURPOSE: To simplify the structure of a resin sealed optical semiconductor device, and improve its resolution in light reception/emission. CONSTITUTION: An optical semiconductor device is formed by sealing an optical semiconductor device 1, such as a light detecting chip and light emitting chip, with transparent resin 4. The face of the sealing resin 4, opposed to the optical semiconductor device 1, is flattened, and a recess 5 the width of which is almost the same as that of the optical semiconductor device, is formed on the flat surface in the position of the optical semiconductor device's optical axis. Light incident upon the tapered face 5a, positioned on the side of the recess 5, is refracted or reflected sideways. Only the light passing through the flat bottom 5b of the recess 5 is received or emitted, which enables the enhancement of resolution. |
