| 摘要 |
PURPOSE: To provide a module component which remarkably improves connection reliability when mounting on a printed circuit board. CONSTITUTION: In the vicinity of the outermost circumference of connection lands 3 formed in lattice on the rear plane of a module substrate 1, reinforcement lands 4, which have a shape of disk, rectangle, hook, etc., and triple the area of one connection land or more, are provided. Thus, the reinforcement lands permit the module component to withstand the stress due to the difference between the thermal expansion coefficients of the printed circuit board and the module substrate, solder fatigue disconnection at the connection land is prevented and connection reliability is remarkably improved.
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