| 摘要 |
<p>PURPOSE: To provide a multilayer sheet for an embossed carrier tape, capable of being subjected to the baking processing, usable for storing an IC package and having specific surface resistivity. CONSTITUTION: A coextruded sheet has at least two-layered structure wherein an outer layer formed of at least one kind of polymer materials, which are selected from among groups comprising a thermoplastic resin having a heat resistance and a thermoplastic alloy resin and which contain an electrically conductive filler, is provided on at least one side face of a base layer formed out of at least one kind of polymer materials, which are selected from among comprising a thermoplastic resin having a heat resistance and a thermoplastic alloy resin. The multilayer sheet wherein the surface resistivity of the outer layer is at most 10<7>Ω/square can be used as a multilayer sheet for an embossed carrier tape, which has a heat resistance of withstanding the baking processing to be performed at 100 deg.C or higher, a stress-cracking resistance and stability in size. The carrier tape can be used suitably for an extra-thin type IC package and the like such as, in particular, TSOP, TQFP, etc.</p> |
