| 摘要 |
<p>PURPOSE: To provide a method of manufacturing a multilayer printed wiring board, wherein molten resin flowing out of an adhesive sheet at compression bonding is restrained from covering an exposed conductor circuit to obtain a circuit of high reliability. CONSTITUTION: When a multilayer printed wiring board equipped with a housing hole 2 for mounting an electronic part and a conductor circuit exposed inside the housing hole 2 is manufactured, a lowermost insulating board 1d, an uppermost insulating board 1u, and a prescribed number of inner circuit boards 1n provided between the insulating boards 1d and 1u are laminated interposing an adhesive sheet between them and bonded into a laminate 10 by pressure, and a through-hole 3 is provided to the laminate 10 and plated with metal for the formation of a multilayer printed wiring board. Insulators 20 are printed at a certain interval on the outer side of an opening 6 which is correspondent to the housing hole 2 on the pasting surface side of the adhesive sheets 7 provided between the lowermost insulating board 1d and the inner circuit board 1n to form resin flow blocking stripe-like grooves 20j.</p> |
