| 摘要 |
PURPOSE: To provide a wire bonding inspection method and equipment which observes the generating situation of defective bonding in wire bonding, during in-process assembling. CONSTITUTION: The ratio of N/M in a 2nd bond part is detected, and the quality of bonding is judged on the basis of the ratio, or on the basis of height H, where N is the distance from a bond tip part 4 to a rupture tip part 5, M is the distance from the rupture tip part 5 to a wire 1 side end portion 6 of a surface 3 crushed by a capillary tool, and H is height of the rupture tip part 5. When bonding is excellent, N/M is sufficiently smaller than 1 and H is also large. On the contrary, when bonding is defective, N/M is large and H is also large. |
