| 摘要 |
<p>PURPOSE: To obtain a resin sealed semiconductor device and manufacturing method therefor in which the reliability is enhanced, without increasing the number of manufacturing steps, by preventing breakage of lead or damage of a resin sealed semiconductor package being mounted. CONSTITUTION: The resin sealed semiconductor device comprises a resin sealed semiconductor package 50 having an opening 16 for exposing a part of the surface 11 of a semiconductor element, a dummy land 10 located at a position corresponding to the mounting position of the resin sealed semiconductor package 50 on a circuit board 1, and a material 3a interposed between the exposed surface 11 and the dummy land 10 in order to bond them.</p> |
