| 摘要 |
PCT No. PCT/JP93/01165 Sec. 371 Date Jun. 22, 1994 Sec. 102(e) Date Jun. 22, 1994 PCT Filed Aug. 19, 1993 PCT Pub. No. WO94/05044 PCT Pub. Date Mar. 3, 1994.A position detection element 4 is formed by sequentially depositing an X-axis resistor film 5, a photoconductive film 6 and a Y-axis resistor film 7 on one surface of a glass substrate 2 which is a transparent member. Further, a light screening film 3 is formed on the other surface of the glass substrate 2. At that time, a pin hole 31 through which light is transmitted is formed at a central portion of the light screening film 3. Where the position detection element 4 and the light screening film 3 are formed integrally with and on the glass substrate 2, mounting of the glass substrate 2 on a casing of a sensor enables the position detection element 4 and the light screening film 3 to be mounted on the casing of the sensor, thus improving the mounting property of the light position detection element 4 and the light screening film 3 on the casing.
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