Plating method by means of an electroless gold plating solution and system therefor

摘要

A plating method by means of an electroless gold solution under air supply in the form of air bubbles from air dispersing bodies (2,15) placed on the bottom of a plating tank (1), whereby more uniform plating can be achieved and the life of the plating solution can be prolonged. Air bubbles are uniformly supplied over the entire region in the plating tank which corresponds to a plating region of a substance to be plated and placed in the plating tank, and the air supply is adjusted depending on the liquid temperature of the plating solution. <IMAGE>