WAFER CUT END SURFACE FINISHING METHOD AND APPARATUS OF SLICING MACHINE

摘要

PURPOSE: To facilitate the cutting operation of a wafer and to shorten the time of a grinding process for finishing by again cutting the protruding part or recessed part of a cut end surface by the cutting blade rotating with respect to the cut end of the wafer after cutting. CONSTITUTION: The cut end surface of a wafer Wa has a protruding or recessed part and an annular cutting blade 2 and an inner peripheral blade 3 take the cutting position of the wafer Wa. The wafer Ha rises again in this state by the way at the time of cutting and the protruding or recessed part of the cut end surface of the wafer Wa is cut by the inner peripheral blade 3. The rising way of the wafer Wa at this time may be the way at the time of cutting but, when the wafer Wa is successively raised while the reciprocal feed thereof is repeated by a small quantity, the escape of the inner peripheral blade 3 is suppressed.