发明名称 |
Method for depositing a layer on a substrate wafer with a sputtering process |
摘要 |
A method for depositing a layer on a substrate is disclosed wherein a collimator having cylindrical holes is employed to reduce the lateral component of a particle flux. The cylindrical holes are aligned to be perpendicular to a substrate wafer and have a variety of radii such that the hole radii are smaller in regions having a higher vertical component of particle flux than in regions which have a lower vertical component of the particle flux.
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申请公布号 |
US5505833(A) |
申请公布日期 |
1996.04.09 |
申请号 |
US19940272589 |
申请日期 |
1994.07.11 |
申请人 |
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发明人 |
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分类号 |
C23C14/34;H01J37/32;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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