| 摘要 |
<p>PURPOSE: To prevent an integrated circuit chip or the like from being broken when bending stress is applied to an IC card by a method wherein electronic parts are arranged outside a loop of an antenna coil in a noncontact type IC card wherein a loop-formed antenna coil is mounted along almost an outer periphery of the card body. CONSTITUTION: Electronic parts such as an integrated circuit chip 13 or the like having built-in microprocessor, and memory, etc., are mounted on an upper surface of a module substrate 12. Then, after mounting the module substrate 12 on an upper surface of a flat rectangular card body 11a made of plastic or the like, a loop formed antenna coil 14 is printed along almost an outer peripheral surface of the upper surface of the card body 11a. In that case, the substrate 12 is positioned at an end part near a short side of a rectangle in the card body 11a outside the loop of the antenna coil 14 of the card body 11a. Then, after wiring the substrate 12 and the antenna coil together 14, a cover body 11b wherein a recess is formed at a position corresponding to the position of the substrate 12 is stuck to the card body 11a to complete an IC card.</p> |
