SEMICONDUCTOR WAFER CASSETTE

摘要

A cassette (114) for supporting a plurality of semiconductor wafers (25) for storage and transport through a plurality of semiconductor fabrication processes. The cassette includes top (156) and bottom plates (158), and support columns (160, 162, 164 and 166) extending between and attached to the top and bottom plates. Each of the plates and support columns is formed from a rigid material to resist warpage. A lower surface of the bottom plate includes three mounts (170a, 170b, 170c) spaced from each other around the periphery of the bottom plate. Each mount includes a trough (171) having angled side walls. Each surface on which the cassette is to be supported includes three pins (174a, 174b, 174c), oriented so as to align with the mounts. The cassette (114) is positioned on a support surface such that each of the pins rests against the lower surface of the bottom plate (158) within the troughs of each mount. Dut to the rigidity of the cassette and the pin/mount registration system, a cassette (114) is precisely and repeatably positioned on all supporting surfaces and a high degree of dimensional control is obtained.